11th Generation Intel Core i3-1115GRE Processor Single Socket FCBGA-1449 System-on-Chip M.2: B-Key, M-Key, E-Key M.2 2242/3042/2280 B-Key (USB3.0/2.0, SATA Gen3/PCI-E Gen3 x1) with nano SIM holder M.2 2230 E-Key (CNVi/PCI-E 3.0 x1/USB2) M.2 2242/2280 M-Key (PCI-E 4.0 x4), NVMe support Up to 64GB Unbuffered Non-ECC SO-DIMM DDR4 3200MHz 2 DIMM slots Dual 2.5GbE LAN w/ Intel I225-IT 4 COM (RS-232/422/485), 3 USB 3.2, 1 USB-C 3.2, 4 USB 2.0, 1 DIO via DB9 1 HDMI 2.0b (4K60Hz), 1 HDMI 1.4b -30°C to 50°C Operating Temperature Lockable 12V DC 84W power adapter Form Factor: 3.5" SBC Dimensions: Width 7.68" (195mm), Height 1.73" (44mm), Depth 5.94" (150mm) Gross Weight: 4.5 lbs (2.04 kg)

3U 5-Node MicroCloud with double-width GPU support Single Socket AMSingle Socket AM5 (LGA-1718) AMD EPYC(TM) 4005/4004 or Ryzen(TM) 7000 / 9000 Series Processor up to 170W with air cooling Support for up to 1 double-width PCIe GPU accelerator card Up to 4 DIMMs supporting up to 192GB DDR5-5600MT/s (1DPC)/ 3600MT/s (2DPC) Up to 1 PCIe 5.0 x16 LP + 1 PCIe 5.0 x4 MicroLP slots Up to 2 internal fixed 2.5" NVMe + 2 internal fixed 2.5" SATA drive bays 4 Redundant 2000W Titanium Level power supplies 3U Rackmount chassis with 30.51" (775mm) depth Form Factor: 3U Rackmount Dimensions: Height 5.16" (131 mm), Width 17.68" (449 mm), Depth 30.51" (775 mm) Gross Weight: 147 lbs (66.68 kg)

Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s(1DPC) in 16 DIMM slots 2x 10 GbE onboard via Broadcom BCM57416 16x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Rear 2.5" SATA Slots, 2x NVMe M.2 (form factor: 2280 and 22110) 4 heavy duty 8cm Fans 2x 1600W Redundant Titanium Level (96%) Hot-plug power supplies Form Factor: 2U Rackmount Dimensions: Height 3.5" (90mm), Width 17.2" (437mm), Depth 27.75" (705mm) Gross Weight: 62 lbs (28.12 kg)

Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage), Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: Dual Socket P (LGA 3647) support 2nd Gen Intel Xeon Scalable processors (Cascade Lake/Skylake) 16 DIMMs, up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel Optane DCPMM 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 60x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 2280 and 22110) Dual Broadcom 3616 IT Mode Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 2600W Redundant Power Supplies Titanium Level (96%) Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16, 1G private Ethernet, and IPMI for robust node fail-over support

Dual Socket P (LGA 3647) support 2nd Gen. Intel Xeon Scalable processors (Cascade Lake/Skylake) 12 DIMMs, up to 3TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel Optane DCPMM 2 PCI-E 3.0 x16 slots, 1 PCI-E 3.0 x8 LP slot, 1 PCI-E 3.0 x4 NVMe M.2 slot 12 Hot-swap 3.5 SAS3/SATA3, 4 Hot- swap 2.5 7mm NVMe/SATA drive bays 2x 10GBase-T ports via Intel C622 IPMI 2.0 + KVM with Dedicated LAN 1 VGA, 4 USB 3.0 (rear)# Internal Cable Arm 600W Redundant Power Supplies Platinum Level Certified Form Factor: 1U Rackmount Dimensions: Width: 17.2 (437mm), Height: 1.7 (43mm), Depth: 38.5 (978mm) Gross Weight: 30 lbs (13.6 kg)

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Dual socket R3 (LGA 2011) supports Intel Xeon processor E5-2600 v4/ v3 family, QPI up to 9.6GT/s Up to 1TB ECC 3DS LRDIMM, up to DDR4- 2400MHz, 8x DIMM slots 1x PCI-E 3.0 (x16) low-profile slot Single port IB (FDR, 56Gbps), w/ QSFP connector Intel i350 Dual port GbE LAN 3x 3.5 Hot-swap SATA3 drive bays 2x SATA DOM 1600W Redundant Power Supplies Titanium Level Form Factor: 2U Rackmount Dimensions: Width: 17.25 (438mm), Height: 3.47 (88mm), Depth: 28.5 (724mm) Gross Weight: 105 lbs (47.6kg)

Single Node High density, 2 rear mirrored boot drives, 4 NVMe SSD drives for caching Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake) 16 DIMMs, up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel® Optane(TM) DCPMM 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 60 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3108 (H/W RAID) Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 2000W Redundant Power Supplies Titanium Level (96%) Form Factor: 4U Rackmount Dimensions: Height 6.96" (177mm), Width 17.68" (449mm), Depth 34.1" (866mm) Gross Weight: 170.5 lbs (77.3kg)

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Dual Socket P (LGA 3647) support 2nd Gen. Intel Xeon Scalable processors (Cascade Lake/Skylake) 16 DIMMs, up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel Optane DCPMM 2 PCI-E 3.0 x16 (LP) slots Flexible Networking support via SIOM, Dedicated IPMI 2.0 LAN 6 Hot-swap 2.5 SAS/SATA drive bays Broadcom 3108 SAS3 controller, RAID 0, 1, 5, 6, 10, 50, 60 with SuperCap option Up to 2200W Redundant Power Supplies Titanium Level (96%) Form Factor: 2U Rackmount Dimensions: Width 17.25 (438mm), Height 3.47 (88mm), Depth 28.5 (724mm) Gross Weight: 90 lbs (40.9kg)

Single Socket E2 (LGA-4710) Single Intel® Xeon® 6 Prozessor 6700/6500 series processors with P-cores or 6700 series processors with E-cores 8 DIMM slots supporting up to 2TB of memory Tool-less, Top-loading riser design support 3 PCIe 5.0 Expansion (2x FHFL + 1x LP) Native SATA drives supported, with option PCIe 5.0 NVMe and SAS Trusted Platform Module (TPM) 2.0 onboard 2x 860W Redundant (1 + 1) Titanium Level (96%) power supplies Form Factor: 1U Rackmount Dimensions: Height 1.7" (43mm), Width 17.2" (437mm), Depth 25.6" (650mm) Gross Weight: 34.5 lbs (15.46 kg)

Dual Socket E2 (LGA-4710) P-cores: Up to 86C/172T; Up to 336MB Cache per CPU E-cores: Up to 144C/144T; Up to 108MB Cache per CPU Supports up to 350W TDP CPUs (Air Cooled) Up to 3 double-width or 6 single-width GPUs Slot Count: 32 DIMM slots Max Memory (1DPC): Up to 2TB 6400MT/s ECC DDR5 RDIMM Max Memory (2DPC): Up to 4TB 5200MT/s ECC DDR5 RDIMM NVMe; RAID 0/1/5/10 support 2x 2000W Redundant (1 + 1) Titanium Level (96%) power supplies Form Factor: 2U Rackmount Dimensions: Height 3.47" (88mm), Width 17.25" (438 mm), Depth 30.7" (780 mm) Gross Weight: 83.78 lbs (38 kg)

Dual Intel® Xeon® 6900 series processors with P-cores, up to 500W TDP Support for up to 10x PCIe GPU accelerator cards 24 DIMM slots, ECC RDIMM / MRDIMM DDR5 Up to 13 PCIe 5.0 x16 FHFL slots 24x U.2/U.3 NVMe and 2x M.2 NVMe Flexible networking with AIOM slots 6x 2700W Redundant Titanium Level (96%) power supplies Form Factor: 5U Rackmountable Dimensions: Height 8.75" (222.5 mm), Width 17.2" (438 mm), Depth 31" (786.1 mm) Gross Weight 100 lbs (45.3 kg)

Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s(1DPC) in 16 DIMM slots 2x 10 GbE onboard via Broadcom BCM57416 1x GbE Dedicated LAN for server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 12x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Rear 2.5" SATA Slots, 2x NVMe M.2 (form factor: 2280 and 22110) 3x 8cm hot-swap counter-rotate redundant PWM cooling fans HW RAID support via Broadcom® 3916 2x 1200W Redundant Titanium Level (96%) Hot-plug power supplies Form Factor: 2U Rackmount Dimensions: Height 3.5" (89mm), Width 17.2" (437mm), Depth 25.6" (650mm) Gross Weight: 58 lbs (26.3 kg)

UP Intel 2U PCIe GPU System with up to 2 NVIDIA RTX PRO(TM) 6000 Blackwell Server Edition or NVIDIA H200 Intel® Xeon® 6700 series processors, Single Socket, CPU TDP supports Up to 350W Support up to 4 double-width PCIe GPU accelerator cards Up to 2TB ECC RDIMM DDR5-6400MT/s and up to 512GB MRDIMM DDR5-8000MT/s in 16 DIMM slots Up to 4 PCIe 5.0 x16 FHFL double-width + 3 PCIe 5.0 x16 FHFL slots Up to 4 front hot-swap E1.S NVMe drive bays 3x 2000W Redundant Titanium Level (96%) power supplies 2U Rackmount chassis with 35.43" (900mm) depth Form Factor: 2U Rackmount Dimensions: Height 3.46" (88 mm), Width 17.25" (438.4 mm), Depth 35.43" (900 mm) Gross Weight: 84 lbs (38 kg)

Single Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores 16 DIMM slots supporting DDR5 RDIMM(2DPC/1DPC) or MRDIMM(1DPC) Support FH DPU and single slot GPU Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible). Breeze through high throughput workloads with PCIe 5.0 NVMe drive support Trusted Platform Module (TPM) 2.0 9672 onboard 2x 1000W Redundant (1 + 1) Titanium Level (96%) power supplies Form Factor: 1U Rackmount Height: 1.7 (43mm), Width: 17.2 (437mm), Depth: 29.4" (747 mm) Gross Weight: 47 lbs (21.3 kg)

Single Socket SP5 AMD EPYC(TM) 9004/9005 Series processor; up to 360W TDP Supports 24 DIMMs with 2DPC, up to 9TB memory capacity with 24 DIMMs of 384GB 3DS RDIMM/RDIMM DDR5 ECC memory 2 PCIe 5.0 x16 slots & 2 AIOM connectors (OCP 3.0 SFF compliant) 32 Hot-swap E3.S (7.5mm) NVMe PCIe5.0 x2 drive bays Redundant Titanium 2000W Power Supplies Form Factor: 2U Rackmount Dimensions: Height 3.5" (89.8 mm), Width 17.2" (438.4 mm), Depth 30.8" (789.9 mm) Gross Weight: 77 lbs (34.93 kg)

Single Intel® Core(TM) Ultra 9/7/5 Series 2 Processor up to 65W with air cooling Support Low-Profile of PCIe GPU cards Up to 2 ECC/Non-ECC SODIMMs supporting up to 96GB with DDR5-6400MT/s 2 RJ45 2.5GbE + 2 RJ45 10GbE LAN ports 1 PCIe 5.0 x16 LP slots 1 internal fixed 2.5" SATA drive bays Form Factor: Fan-based Embedded Dimensions: Height 1.69" (43mm), Width 10.43" (264.8mm), Depth 8.89" (225.8mm) Gross Weight: 7.5 lbs (3.4 kg)

Architektur: NVIDIA Grace Blackwell GPU: NVIDIA Blackwell-Architektur CPU: 20 Recheneinheiten Arm,10 Cortex-X925 + 10 Cortex-A725 CUDA-Recheneinheiten: Blackwell-Generation Tensor-Recheneinheiten: 5. Generation RT-Recheneinheiten: 4. Generation Tensor-Leistung1: 1 PFLOP Arbeitsspeicher: 128 GB LPDDR5x, einheitlicher Systemspeicher Speicherschnittstelle: 256 bit Speicherbandbreite: 273 GB/s Datenspeicher: 1TB NVME.M2 mit Selbstverschlüsselung USB: 4x USB TypeC Ethernet: 1 x RJ-45-Anschluss 10 GbE NIC: ConnectX-7 Smart NIC WLAN: WiFi 7 Bluetooth: BT 5.3 Audioausgabe: HDMI-Mehrkanal-Audioausgabe Energieverbrauch: TBD Bildschirmanschlüsse: 1x HDMI 2.1a NVENC | NVDEC: 1x | 1x Betriebssystem: NVIDIA DGX™ Base OS, Ubuntu Linux Systemabmessungen: 150 mm L x 150 mm W x 50.5 mm H Systemgewicht: 1,2 kg