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Dimension: 13.00 X 7.50 X 1.00
Application: Automotive
IC: WINBOND
IC Organisation: 512Mbx16
Package: FBGA-96ball
Speed: 1600 MHz
Quantity: 2
Capacity: 8Gbit
Latency: CL11
Quantity: 1520
Product Status: Mass Production
RoHS: Ja
Technology: IC SDRAM DDR3
Temperature Range: -40°C to +85/95
MOQ: Tray
Voltage: 1,35 / 1,5

Product information "IC SDRAM DDR3L-1600 8Gbit 512Mx16 Winbond 1,35/1,5V FBGA-96ball I-TEMP"

Single rank Dual-Die-Package (DDP), 2x 4Gbit 512Mx8 CL11, RoHS compliant (Lead-Free&Halogen-Free) industrial temperature grade -40°C to +85°C (95°C) Tray 1520pcs (190pcs per Tray)