Product information "IC NAND Flash 2Gbit SLC Winbond 1,8V FBGA-63ball I-TEMP"
46nm
industrial temperature grade -40°C to +85°C
Tray 1680pcs (210pcs per Tray)
| Dimension: | 11.00 X 09.00 X 1.00 |
|---|---|
| Application: | Embedded / Industrial |
| IC: | WINBOND |
| IC Organisation: | x8 |
| Package: | FBGA-63ball |
| Speed: | 104 MHz |
| Quantity: | 2 |
| Capacity: | 2Gbit |
| Quantity: | 1680 |
| Product Status: | Mass Production |
| RoHS: | Ja |
| Technology: | FLASH SLC |
| Temperature Range: | -40°~+85°C |
| Description NOR: | SPI |
| MOQ: | Tray |
| Voltage: | 1,8V |