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Product information "IC Flash NOR SPI 512Mbit Winbond 2,7-3,6V TFBGA-24ball 8x6mm I-TEMP"

IC Flash NOR SPI QE = 1 (fixed) Tray 3840pcs
Dimension: 8,00 X 6,00 X 1,20
Application: Embedded / Industrial
IC: WINBOND
Package: TFBGA-24ball
Speed: 133 MHz
Quantity: 2
Capacity: 512Mbit
Quantity: 3840
Product Status: Mass Production
RoHS: Ja
Technology: FLASH NOR SPI
Temperature Range: -40° ~ +85
Description NOR: SPI
MOQ: Tray
Voltage: 2,7 - 3,6