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Product information "IC UFS3.1 512GB 11.5X13.0X1.72 Samsung FBGA-153ball AUTOMOTIVE"

RoHS compliant (Lead-Free&Halogen-Free) Automotive temperature grade -40°C to +105°C Tray
Dimension: 11.50 X 13.00 X 1.72
Application: Embedded / Industrial
IC: Samsung
Package: FBGA-153ball
Capacity: 512GB
RoHS: Ja
Technology: UFS3.1
Temperature Range: -40°C - 105
MOQ: Tray