Product information "IC UFS3.1 256GB 11.5X13.0X1.2 Samsung FBGA-153ball I-TEMP"
RoHS compliant (Lead-Free&Halogen-Free)
industrial temperature grade -40°C to +95°C
Tray
| Dimension: | 11.50 X 13.00 X 1.20 |
|---|---|
| Application: | Embedded / Industrial |
| IC: | Samsung |
| Package: | FBGA-153ball |
| Capacity: | 256GB |
| RoHS: | Ja |
| Technology: | UFS3.1 |
| Temperature Range: | -40°C - 95 |
| MOQ: | Tray |