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Dimension: 14.00 X 9,00 X 1.10
Application: Embedded / Industrial
IC: Samsung
IC Organisation: 512Mx16 DDP
Package: FBGA-78ball
Speed: 1600 MHz
Quantity: 2
Capacity: 8Gbit
Latency: CL11
Quantity: 1120
RoHS: Ja
Technology: IC SDRAM DDR3
Temperature Range: 0°C to 85°C/95
MOQ: Tray
Voltage: 1,35 / 1,5

Product information "IC SDRAM DDR3L-1866 8Gbit 512Mx16 DDP Samsung 1,35V FBGA-96ball"

CL13, RoHS compliant (Lead-Free&Halogen-Free) commercial temperature grade 0°C to +85°C (95°C) Tray 1280pcs