Product information "IC eMMC5.1 16GB 11.5X13.0X0.8 SK hynix FBGA-153ball I-TEMP"
3D TLC BiCS3
RoHS compliant (Lead-Free& Halogen-Free)
industrial Temperature Grade -40°C to +85°C
| Dimension: | 11.50 X 13.00 X 1.00 |
|---|---|
| Application: | Embedded / Industrial |
| IC: | PHISON |
| Package: | FBGA-153ball |
| Capacity: | 128GB |
| RoHS: | Ja |
| Technology: | eMMC5.1 (3D NAND Flash) |
| Temperature Range: | -40°C - 85 |