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Module configuration: 18
Capacity: 32GB
Chip manufacturer: Samsung - K4AAG085WA-BITD
Chip organization: 2Gx8
Data Integrity Check: ECC
Form factor: SO-DIMM ECC 260pin
Speed: DDR4-2666 (PC4-2666)
Warranty: 2
ISO9001: ISO9001
Jedec-Norm: Jedec-Norm
Latency: CL19
Module manufacturer: Memorysolution
Module configuration: 8Gx72
Module dimensions: 69,6 x 30,1 x 4,0
Operating Temperature: -40°C to +85/+95
RAM-Features: unbuffered
Technology: DDR4 SDRAM SO-DIMM ECC
Temperature grade: Industrial
Type: Serverspeicher
Supply voltage: 1.2

Product information "Industrie SO-DIMM 32GB ECC DDR4-2666 CL19 (1Gx8) (1,2V) DR - I-TEMP"

260pin, DR, 1,2V, Samsung IC: 18 ICs - K4AAG085WA-BITD Pb-free ROHS, Warranty 2Y Operating Temperature Grade: -40°C to +85°C (+95°C) Storage Temperature: -40°C to +95°C