IC SERIAL NOR FLASH SPI 256Mbit Winbond 2.7-3.6V TFBGA-24 ball 8x6mm I-TEMP

Product number:
AW25Q256JVBIM/TR
EAN:
Manufacturer no.:
W25Q256JVBIM/TR

Price on request

Product information "IC SERIAL NOR FLASH SPI 256Mbit Winbond 2.7-3.6V TFBGA-24 ball 8x6mm I-TEMP"
IC SERIAL NOR FLASH SPI QE = 0 (programmable) RoHS Compliant (Lead-free, Halogen-free, Antimony-Oxide-free) industrial temperature grade -40°C to +85°C Tape&Reel 2000pcs COO Taiwan
Applikation: Embedded / Industrial
Kapazität: 256Mbit
Typenbeschreibung NOR: SPI
Abmessungen: 8 x 6
Chiphersteller: WINBOND
VPE: Tape&Reel
Gehäuse: 8-WSON
Produkt Status: Mass Production
Gewährleistung: 2
Menge: 2000
RoHS-Konform: Ja
Geschwindigkeit: 133 MHz
Technologie: FLASH NOR SPI
Temperaturbereich: -40° to +85
Versorgungsspannung: 2.7-3.6V

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