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Product information "IC Flash NOR SPI 4Mbit Winbond 3,3V XSON-8pad 3x2 mm I-TEMP Plus"

IC Flash NOR SPI Dual and Quad SPI RoHS compliant (Lead-Free, Halogen-Free, Antimony-Oxide-Free) industrial plus temperature grade -40°C to +105°C Tray
Dimension: 3,00 X 2,00 X 0,40
Application: Embedded / Industrial
IC: WINBOND
Package: XSON 8-pad 3x2 mm
Speed: 104 MHz
Quantity: 2 Jahre
Capacity: 4Mbit
RoHS: Ja
Technology: FLASH NOR SPI
Temperature Range: -40° ~ +105
Description NOR: SPI
MOQ: Tray
Voltage: 2,3 - 3,6