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Product information "IC eMMC5.1 8GB 11.5X13.0X1.13 SMI FBGA-153ball"

Ferri-eMMC supports HS400 and FFU based on Samsung 14nm MLC Wafer RoHS compliant (Lead-Free&Halogen-Free) mobile temperature grade -25°C to +85°C Tray
Dimension: 11.50 X 13,00 X 1.13
Application: Embedded / Industrial
IC: SMI
Package: FBGA-153ball
Speed: eMMC HS400 Mode
Quantity: 2
Capacity: 8GB
RoHS: Ja
Technology: eMMC5.1
Temperature Range: -25°C - 85
MOQ: Tray
Voltage: 1.8 / 3.3 V