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Product information "IC UFS3.1 256GB 11.5X13.0X0.8 Samsung FBGA-153ball"

RoHS compliant (Lead-Free&Halogen-Free) mobile temperature grade -25°C to +85°C Tray
Dimension: 11.50 X 13.00 X 0.80
Application: Embedded / Industrial
IC: Samsung
Package: FBGA-153ball
Capacity: 256GB
RoHS: Ja
Technology: UFS3.1
Temperature Range: -25°C - 85
MOQ: Tray