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Product information "IC UFS2.1 64GB 11.5X13.0X1.9 Samsung FBGA-153ball"

MLC, 128Gb x 4 based, HS-GEAR3 2Lane, 1.8 / 3.3V RoHS compliant (Lead-Free&Halogen-Free) Operating temperature: -25°C to +85°C Storage temperature: -40°C to +85°C Tray
Dimension: 11.50 X 13,00 X 1.00
Application: Embedded / Industrial
IC: Samsung
IC Organisation: 128Gb x 4
Package: FBGA-153ball
Speed: HS-GEAR3 2Lane
Quantity: 2
Capacity: 64GB
Quantity: 1280
Product Status: Mass Production
RoHS: Ja
Technology: UFS2.1
Temperature Range: -25°C - 85
Description NAND: MLC
MOQ: Tray
Voltage: 1.8 / 3.3 V