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Product information "IC eMMC5.1 64GB 11.5X13.0X0.8 Samsung FBGA-153ball"

3D TLC NAND RoHS compliant (Lead-Free&Halogen-Free) mobile temperature grade -25°C to +85°C
Application: Embedded / Industrial
IC: Samsung
Package: FBGA-153ball
Speed: eMMC HS400 Mode
Quantity: 2
Capacity: 128GB
RoHS: Ja
Technology: eMMC5.1 (3D NAND Flash)
Temperature Range: -25°C - 85
MOQ: Tray
Voltage: 1.8 / 3.3