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Product information "IC eMMC5.1 16GB 11.5X13.0X0.8 Samsung FBGA-153ball"

RoHS compliant (Lead-Free&Halogen-Free) mobile temperature grade -25°C to +85°C Tray 1120pcs
Dimension: 11.50 X 13,00 X 0.80
Application: Embedded / Industrial
IC: Samsung
IC Organisation: 128Gb x 1
Package: FBGA-153ball
Speed: eMMC HS400 Mode
Quantity: 2
Capacity: 16GB
Quantity: 1120
Product Status: Mass Production
RoHS: Ja
Technology: eMMC5.1 (3D NAND Flash)
Temperature Range: -25°C - 85
MOQ: Tray
Voltage: 1.8 / 3.3 V