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Product information "32GB Samsung DDR3-1333 CL9 (DDP2Gx4) ECC reg. QR LV (1,35V)"

M393B4G70BM0-YH9 4 Gbit B-Die, 30nm Class, Green Memory Gen. 2, 240PIN 36C/DS 4R 1,35V 1,18" FBGA Pb-/Halogen-free PC3-10600 COO: KOREA
Capacity: 32GB
Chip manufacturer: Samsung
Chip organization: DDP 2Gx4
Data Integrity Check: ECC
Form factor: 240pin LongDIMM
Speed: DDR3-1333 (PC3-10600)
Warranty: 2
ISO9001: ISO9001
Jedec-Norm: Jedec Norm
Latency: CL9
Module manufacturer: Samsung
Module configuration: Quad Rank
Module dimensions: 133,35 x 30 x 4
RAM-Features: registered
Technology: DDR3 SDRAM
Type: RDIMM
Supply voltage: 1,35