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Product information "128GB Samsung DDR4-3200 CL26 (4Gx4) 3DS ECC reg. 2S2Rx4"

M393AAG40M32-CAECO 288PIN 2S2Rx4 TSV 3DS/3D-Stacked RAM, 36 Chips, 2x 16Gbit die per Chip, 1,2V 1,23" Pb-/Halogen-free RoHS PC4-3200Korea
Capacity: 128GB
Chip manufacturer: Samsung
Chip organization: 2H 3DS 8Gx4
Data Integrity Check: ECC
Form factor: 288pin LongDIMM
Speed: DDR4-3200 (PC4-3200)
Warranty: 2
ISO9001: ISO9001
Jedec-Norm: Jedec Norm
Latency: CL26
Module manufacturer: Samsung
Module configuration: 3D-Stacked
Module dimensions: 133,35 x 30 x 4
RAM-Features: registered
Technology: DDR4 SDRAM
Type: RDIMM
Supply voltage: 1.2