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Product information "128GB Samsung DDR4-2666 CL22 (2Gx4) 3DS LRDIMM 2S4Rx4"

M386AAK40B40-CWD6Y, 288PIN 2S4Rx4 TSV 3DS/3D-Stacked RAM, 36 Chips, 4x 8Gbit die per Chip, 1,2V 1,23" Pb-/Halogen-free RoHS PC4-2666 COO: Korea
Capacity: 128GB
Chip manufacturer: Samsung
Chip organization: 4H 3DS 8Gx4
Data Integrity Check: ECC
Form factor: 288pin LongDIMM
Speed: DDR4-2666 (PC4-2666)
Warranty: 2
ISO9001: ISO9001
Jedec-Norm: Jedec Norm
Latency: CL22
Module manufacturer: Samsung
Module configuration: 3D-Stacked
Module dimensions: 133,35 x 30 x 4
RAM-Features: load-reduced
Technology: DDR4 SDRAM
Type: LRDIMM
Supply voltage: 1,2