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Product information "IC eMMC5.1 16GB 11.5X13.0+B42X0.8 SK hynix FBGA-153ball I-TEMP"

3D TLC BiCS3 RoHS compliant (Lead-Free& Halogen-Free) industrial Temperature Grade -40°C to +85°C
Dimension: 11.50 X 13.00 X 1.00
Application: Embedded / Industrial
IC: PHISON
Package: FBGA-153ball
Capacity: 128GB
RoHS: Ja
Technology: eMMC5.1 (3D NAND Flash)
Temperature Range: -40°C - 85